"Development of 3D Wiring Forming Technology" awarded the Excellence Award at the Electronics Packaging Society Conference.
Fujikura Electronic Components and Connectors Division
Our company received the Excellence Award at the 38th Electronics Spring Conference, hosted by the Japan Society of Electronics Packaging. This award is given for outstanding academic and technical presentations and papers at the conference. In this award, the application of vacuum and pressure forming methods, as well as transfer printing techniques, was recognized for enabling the formation of three-dimensional and multilayer circuits with tail wiring for connection to external terminals on thermoplastic resins such as ABS and polycarbonate.
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