Silicon carbide, SiC particles
Silicon carbide, SiC particles
Introduction of silicon carbide (SiC) particles.
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250nm SiC ultrafine particles for high-density sintered bodies silicon carbide
[Low-temperature sintering, high densification, high purity] SiC ultrafine particles with an average particle diameter of 250nm contribute to the densification of the sintered body!
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Fujimi / Sintered Heat Dissipation Filler with α-type SiC Ultra-fine Particles Silicon Carbide
A diverse lineup of α-type SiC with an average particle size ranging from 250 nm to 58 μm! Suitable for sintered body materials, wear-resistant coatings, plating additives, and heat dissipation fillers!
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Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC'
Resistant to chemicals, it self-generates sharp grinding edges through crushing, demonstrating excellent polishing power!
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Black carbonized silicon grinding material 'C'
Alpha-type silicon carbide abrasive material used for precision lapping of grinding cloth, ultra-fine precision grinding stones, cast iron, brass, etc.
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Prepreg materials for ceramic matrix composites (CMC)
We select fibers and matrices according to the customer's purpose/application and provide prepreg! (Development product)
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【NEW】Heat dissipation and thermal conductivity filler - rounded silicon carbide (SiC)
A next-generation thermal conductive filler that combines high thermal conductivity and chemical stability, featuring a rounded shape that excels in fillability and fluidity.
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Heat dissipation and thermal conduction filler, spherical silicon carbide (SiC)
It combines high thermal conductivity and chemical stability, with excellent fillability and fluidity in a rounded shape.
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May Ceramics Exhibition [Osaka] Exhibit Heat Dissipation Filler Rod-shaped Zinc Oxide
Actual display at the Ceramic Exhibition in Osaka: A high aspect ratio thermal filler that can be expected to improve thermal conductivity performance, such as TIM, by being added as a sub-filler.
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