Heat dissipation and thermal conduction filler, spherical silicon carbide (SiC)
It combines high thermal conductivity and chemical stability, with excellent fillability and fluidity in a rounded shape.
"Silicon carbide (SiC)" is a high-performance heat dissipation material that is gaining attention in the field of electronic materials. In addition to its excellent thermal conductivity, it also possesses heat resistance, wear resistance, and chemical resistance, demonstrating high effectiveness even in areas where conventional boron nitride and aluminum nitride do not provide sufficient performance. Additionally, our company will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN" held at Makuhari Messe. We sincerely look forward to your visit. 【Features of Rounded Silicon Carbide】 ■ Optimized high thermal conductivity material (270 W/m K) for fillers ■ Achieves low viscosity with a smooth filler surface *For more details, please download the PDF or feel free to contact us.
basic information
【Exhibition Overview】 ■Exhibition Name: 10th Advanced Ceramics Exhibition CERAMIC JAPAN ■Dates: November 12 (Wednesday) to 14 (Friday), 2025 ■Opening Hours: 10:00 AM to 6:00 PM (ends at 5:00 PM on the final day) ■Venue: Makuhari Messe Exhibition Hall 2 ■Booth Number: 9-13 ■Registration is required for entry *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Main Uses and Application Areas】 ■ Products requiring TIM (Thermal Interface Material) or high fluidity - Heat dissipation sheets - Heat dissipation grease - Heat dissipation adhesives - Heat dissipation gap fillers - Sealants, etc. *For more details, please download the PDF or feel free to contact us.
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Notice of Participation in Nanotech 2026 (January 28-30)
We will be exhibiting at the "nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference" held at Tokyo Big Sight (West Hall 3, Booth No. 3W-H14) from January 28 (Wednesday) to January 30 (Friday), 2026. At our booth, we will showcase various functional powders that we are developing. We invite you to visit our booth. ◆nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference◆ Dates: January 28 (Wednesday) to January 30 (Friday), 2026 Opening Hours: 10:00 AM to 5:00 PM Venue, Our Booth Location: Tokyo Big Sight, West Hall 3, Booth No. 3W-H14 Nanotech2026 Official Website: https://www.nanotechexpo.jp/ Registration is required for entry to nano tech 2026. Please obtain your visitor badge in advance and come to the event. https://unifiedsearch.jcdbizmatch.jp/nanotech2026/jp/invitation/5ayDY47cpRY
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Notice of Participation in the 10th Ceramics Exhibition (High-Performance Materials WEEK) to be held from November 12 to 14.
We will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN," which will be held from November 12 (Wednesday) to 14 (Friday), 2025, at Makuhari Messe (Exhibition Hall 2). Our booth will showcase various functional powders that we are developing. We invite you to visit our booth. ◆ 10th High-Performance Ceramics Exhibition CERAMIC JAPAN ◆ Dates: November 12 (Wednesday) to 14 (Friday), 2025 Opening Hours: 10:00 AM to 6:00 PM (ends at 5:00 PM on the final day) Venue: Makuhari Messe, Exhibition Hall 2 Booth Number: 9-13 Official Website of the High-Performance Ceramics Exhibition: https://www.material-expo.jp/tokyo/ja-jp.html Registration is required for entry to the High-Performance Ceramics Exhibition. Please obtain your visitor badge in advance from the link below and come to the event.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.