Polishing and etching materials for compound semiconductors, 'INSEC'
Finishing compound semiconductor crystals to a mirror-like precision through mechanochemical processing!
"INSEC" is a polishing material that precisely finishes compound semiconductor crystals to a mirror surface through mechanochemical processing. It comes in a variety of types, including "FP (primary polishing material)" and "NIB (final polishing material)" for GaAs wafers, as well as "P (final polishing material)" for GaP wafers. Additionally, we offer "SP," a polishing material specifically for precision polishing of GaAs wafers, and "IPP (primary polishing material)" for InP wafers. It is also effective as an etching material for GaAs and GaP LED-related applications. All of these materials are in granular form and are dissolved just before use. 【Features】 ■ Polishing material that finishes to a mirror surface with high precision ■ Wide variety of types ■ Effective as an etching material for GaAs and GaP LED-related applications *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Recommended Dissolution Ratio】 ■INSEC FP ・〈INSEC FP〉46g : Pure Water 1,000 cc ■INSEC NIB ・〈INSEC NIB〉36g : Pure Water 1,000 cc ■INSEC SP ・〈INSEC SP Granules〉6g : Colloidal Silica 1,000 cc : Pure Water 3,000 cc ■INSEC IPP ・〈INSEC IPP Granules〉80g : Colloidal Silica 500 cc : Pure Water 4,500 cc *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
