Diamond slurry polishing material "DIATEC"
Diamond slurry polishing material suitable for lapping ferrite, superhard metals, ceramics, and more.
"DIATEC" is a slurry-type abrasive that combines finely graded diamond powder with a special grinding liquid. It consistently maintains stable polishing power, enabling high efficiency and high precision mirror finishing. Various types are available, including concentration (M: Medium, H: Heavy) and types of diamonds (A: Single crystal, D: Polycrystalline), allowing for the selection of items suitable for the workpiece. [Features] - Mixture of finely graded diamond powder and special grinding liquid - Slurry-type abrasive - Consistently maintains stable polishing power - Diverse types available *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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PowerDebug E40 This is the entry-level debugger unit. It provides performance that strongly supports both simple and complex debugging tasks. It can be connected to a Host PC via USB 3.0.
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PowerDebug X51 This is a high-end model debugger. It is a high-performance, modular, and future-proof debugging controller. Off-chip trace is expandable. It can be connected to the Host PC via USB 3.0 or Ethernet (2.5 Gbit/s).
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DebugProbe This is a debug probe for TriCore Aurix. It connects to the debugger (E40 or X51) and is used for connecting to the target device, enabling basic debugging. The connector for the target is 26-pin (LA-3203). An optional conversion adapter for different connector shapes is available.
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PowerTrace Serial2 is a trace expansion module. The connection to the device is via high-speed serial. It supports Aurola/HSSTP/PCIe Gen2/3/4. The built-in trace memory is 8 GBytes. It is also possible to stream trace data to the Host PC. It is used by connecting to the expansion port of the X51 debugger.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.