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Manufacturing technology for nano and submicron particles

Nano-submicron particle manufacturing technology

Fujimi, which manufactures and sells abrasives and other products for a wide range of fields, has been enhancing its core technology cultivated over more than 60 years since its founding in 1950, and will continue to challenge new applications. At Fujimi, we have succeeded in producing particles of various shapes with uniform particle size, free of coarse and fine particles, through hydrothermal synthesis. Additionally, through wet grinding and wet classification, we can produce submicron fine particles with uniform particle size, as well as homogeneous and uniformly sized spherical composite (sintered) particles using combinations of ceramics, metals, and resins. [Fujimi's Technology] ■ Particle synthesis at the 100–1000nm level ■ Particle grinding and classification at the 0.1–5μm level ■ Particle compositing at the 1-20μm level *For more details, please refer to the PDF document or feel free to contact us.

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Nano-submicron particle manufacturing technology

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.