Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide.
Fujimi / Forms a thermal conduction path with a high aspect ratio, improving thermal conductivity for TIMs and more! The rounded surface ensures good filling properties for resins and other materials.
In recent years, the high functionality of communication and mobility has led to issues with heat generation in electronic devices, increasing expectations for heat dissipation materials. Zinc oxide, like common alumina (aluminum oxide) and magnesia (magnesium oxide), has high thermal conductivity and possesses the following advantages: - Low Mohs hardness, resulting in low aggressiveness towards equipment used to manufacture heat dissipation materials - Low thermal expansion coefficient, leading to minimal impact on dimensional changes of heat dissipation materials - Superior water resistance compared to magnesia Our company has successfully developed rod-shaped zinc oxide using our unique particle synthesis technology. Rod-shaped zinc oxide is expected to have three effective benefits for heat dissipation materials: 1) Its high aspect ratio makes it easy to form thermal conduction paths 2) Its rounded corners, due to the crystal structure, make it easy to fill into resins and other materials 3) It is easier to secure contact surface area between fillers compared to spherical particles If you have any of the following challenges, please feel free to contact us: - You want to try heat dissipation/thermal conduction fillers with unique shapes - You are struggling with the difficulty of filling boron nitride fillers (to be combined as a bulking filler) - You are facing issues with water resistance measures for aluminum nitride
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Notice of participation in the 11th Ceramics Exhibition at the High-Performance Materials Week from May 13 to 15 [Osaka].
[May 13-15] Announcement of Participation in the 11th Advanced Ceramics Exhibition [Osaka] Our company will participate in the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held for three days from May 13 (Wednesday) to May 15 (Friday), 2026, at Intex Osaka (Hall 4, Booth No. K6-24). We will showcase various functional powders that we are developing at our booth. We invite you to visit our booth. ◆ 11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN ◆ Dates: May 13 (Wednesday) - May 15 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue and Our Booth Location: Intex Osaka, Hall 4, Booth No. K6-24 Official Website of the Advanced Ceramics Exhibition [Osaka]: https://www.material-expo.jp/osaka/ja-jp.html Registration is required for entry to the Advanced Ceramics Exhibition [Osaka]. Please obtain your visitor badge in advance from the link below before attending.
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Notice of Participation in Nanotech 2026 (January 28-30)
We will be exhibiting at the "nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference" held at Tokyo Big Sight (West Hall 3, Booth No. 3W-H14) from January 28 (Wednesday) to January 30 (Friday), 2026. At our booth, we will showcase various functional powders that we are developing. We invite you to visit our booth. ◆nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference◆ Dates: January 28 (Wednesday) to January 30 (Friday), 2026 Opening Hours: 10:00 AM to 5:00 PM Venue, Our Booth Location: Tokyo Big Sight, West Hall 3, Booth No. 3W-H14 Nanotech2026 Official Website: https://www.nanotechexpo.jp/ Registration is required for entry to nano tech 2026. Please obtain your visitor badge in advance and come to the event. https://unifiedsearch.jcdbizmatch.jp/nanotech2026/jp/invitation/5ayDY47cpRY
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.