【NEW】HRA92 equivalent high hardness cemented carbide powder for layered manufacturing.
Achieving high hardness equivalent to HRA92 with a 3D printer! Introducing a molded body made using newly developed WC-TiC-Co based powder for additive manufacturing.
Until now, our high-hardness powder for 3D printers has had a hardness limit of around 87HRA for the molded body, which posed challenges in applications for parts made from some ultra-hard alloys due to insufficient hardness. The newly developed hard powder has a main phase of WC-TiC-Co, and by achieving a fine microstructure, we have significantly improved the hardness of the molded body to 92HRA. This enables 3D printing of ultra-hard alloy powders that require high hardness, contributing to the resolution of conventional challenges. **Expected Applications** - High-precision press molds (extended lifespan and stabilized precision) - Special cutting tools (high wear resistance and high reliability) - Prototype manufacturing (shortened delivery times) Furthermore, since we possess metal 3D printer equipment, we can provide a comprehensive service that goes beyond mere powder sales, including ultra-hard molding tests, material property evaluations, and prototype support. For customers looking for "ultra-hard alloy 3D printing," "hard powder for metal 3D printers," or "ultra-hard powder materials," we offer a total solution that combines materials, molding, and evaluation. Please feel free to contact us for inquiries about the introduction of next-generation ultra-hard alloy 3D printing or prototype consultations.
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WC-TiC-Co based ultra-hard alloy powder
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【Expected Applications】 - High-precision press molds (extended lifespan and stabilized accuracy) - Special cutting tools (high wear resistance and high reliability) - Prototype manufacturing (shortened delivery times)
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.