Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide.
Rod-shaped zinc oxide, a high aspect ratio thermal filler that can be expected to improve thermal conductivity performance such as TIM when added as a sub-filler.
In recent years, with the advancement of communication and mobility technologies, there has been an increasing expectation for heat dissipation materials in electronic devices. As a distinctive heat dissipation material, we have developed "rod-shaped zinc oxide" using our particle synthesis technology. Rod-shaped zinc oxide is a material that possesses high thermal conductivity similar to alumina and has a high aspect ratio rod shape. By blending rod-shaped zinc oxide in a balanced manner with the main filler, an efficient thermal conduction path can be formed, which is expected to enhance the thermal conductivity performance as a TIM material. It is also possible to control the particle size in the long axis direction, allowing for adjustments based on the particle size of the main filler. ◆ Features - The high aspect ratio rod shape makes it easy to form thermal conduction paths. - When combined with spherical alumina or aluminum nitride as the main filler, a boosting effect on heat dissipation is expected. - The rounded corners due to the crystal structure make it easy to fill into resins and other materials. If you have any of the following challenges, please feel free to contact us: - I would like to try a heat dissipation filler with a distinctive shape. - I want to add a sub-filler to improve thermal conductivity. - I want to reduce the total amount of heat dissipation filler while maintaining thermal conductivity.
basic information
For more details, please refer to the PDF document or feel free to contact us. We also accept requests for samples.
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Applications/Examples of results
- TIM (Thermal Interface Material) and others: thermal sheets, thermal grease, thermal adhesive, thermal gap filler, sealing materials, etc.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.