Notice of Participation in the 37th Internepcon Japan / Electronics Development and Implementation Exhibition【HIWIN】

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We will be exhibiting at the "37th Internepcon Japan/Electronics Development and Implementation Exhibition" held at Tokyo Big Sight from January 25, 2023. ◇ Event Period January 25 (Wednesday) to January 27 (Friday), 2023, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 1, 3-18 ◇ Featured Exhibits ■ Wafer Transport Robot With key components such as DD motors and high-rigidity cross roller bearings manufactured and developed in-house, we achieve both high performance and affordability. This robot is not limited to wafer transport but can also be used for PCB and glass substrate transport applications. It has no gears, resulting in less aging deterioration and fewer parts, which reduces maintenance workload. ■ Wafer Aligner The HIWIN Pre-Aligner (HPA series) is a 3-axis controlled product that utilizes HIWIN single-axis robot modules, achieving high speed, high precision, high rigidity, high efficiency, and space-saving design. ■ Ultra-Thin DD Motor [DMT Series] A physical display of the upcoming large model DMTK3 will also be showcased.

Highwin Exhibit at the 37th Internepcon Japan

High-performance, high-rigidity wafer transport robot

Date and time Wednesday, Jan 25, 2023 ～ Friday, Jan 27, 2023
10:00 AM ～ 05:00 PM
Capital Tokyo Big Sight, East Hall 1, 3-18
Entry fee Free If you use the e-invitation ticket, you can enter for free. Please check the details and application button below.

Related product information

HIWIN Wafer Handling Robot [E Series]
High precision & high rigidity! Wafer transport robot compatible with 2-12 inch wafers [E Series]

Single Arm / Double Arm Arm Length: 135mm / 165mm / 185mm The end effector supports vacuum suction, gripping, and inverting methods.
HIWIN Wafer Aligner
Achieving high speed, high precision, high rigidity, high efficiency, and space-saving! The 【HIWIN Wafer Aligner】 compatible with 2-12 inches.

- Lineup compatible with 2-12 inches - Wafer alignment possible in as short as 4.9 seconds - Correction operations for wafer center and angle can be performed simultaneously, achieving a repeatability accuracy of ±0.1 mm - Cleanliness Class 1
Equipped with an absolute encoder: Next-generation DD motor
Reduction of development and maintenance man-hours! A next-generation DD motor that enables high-efficiency work without the need to return to the starting point.

【Equipped with Absolute Encoder】Features of Next-Generation DD Motor - Backlash-free and maintenance-free due to direct drive system - Achieves high-precision positioning control - High load capacity due to high-rigidity bearings - Improved work efficiency due to high-speed rotation capability - No need for origin return operation or control program - Allows for quick device restart during emergency stops or startup - Outer rotor type matches high inertia loads - Hollow shaft design makes wiring routing and spatial design easy - Compact design for rotation and movement structure
DD Motor
For various automation tasks. Hiwin's DD motor.

For details, please refer to the catalog or contact us.
DD motor - torque motor
■■Active in various automation tasks■■ HIWIN's direct drive DD motors and torque motors

For details, please refer to the catalog or contact us.