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HIWIN Wafer Aligner

Achieving high speed, high precision, high rigidity, high efficiency, and space-saving! The 【HIWIN Wafer Aligner】 compatible with 2-12 inches.

The HPA series of the HIWIN Pre-Aligner is a 3-axis controlled product that utilizes HIWIN's single-axis robot module, achieving high speed, high precision, high rigidity, high efficiency, and space-saving design. With an integrated controller design (all-in-one), there is no need for external controller placement or wiring space, making it the smallest in volume in its class. It is equipped with an intelligent translucent laser sensor that can detect the contours of objects such as transparent, translucent, and opaque materials. It can accommodate wafers and glass with a minimum diameter of 2 inches and a maximum of 12 inches.

Welcome to the HIWIN Wafer Aligner page.

basic information

- Lineup compatible with 2-12 inches - Wafer alignment possible in as short as 4.9 seconds - Correction operations for wafer center and angle can be performed simultaneously, achieving a repeatability accuracy of ±0.1 mm - Cleanliness Class 1

Price range

Delivery Time

Model number/Brand name

HIWIN Wafer Transport Robot DD Motor Aligner

Applications/Examples of results

Alignment in the semiconductor industry (wafers), LED industry (sapphire substrates), and optoelectronics industry (glass), etc.

Wafer Transport Robot Catalog

PRODUCT

HIWIN [PoC Manufacturing Support] Information Brochure

OTHER

Wafers Road Port Catalog

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