HIWIN Wafer Aligner
Achieving high speed, high precision, high rigidity, high efficiency, and space-saving! The 【HIWIN Wafer Aligner】 compatible with 2-12 inches.
The HPA series of the HIWIN Pre-Aligner is a 3-axis controlled product that utilizes HIWIN's single-axis robot module, achieving high speed, high precision, high rigidity, high efficiency, and space-saving design. With an integrated controller design (all-in-one), there is no need for external controller placement or wiring space, making it the smallest in volume in its class. It is equipped with an intelligent translucent laser sensor that can detect the contours of objects such as transparent, translucent, and opaque materials. It can accommodate wafers and glass with a minimum diameter of 2 inches and a maximum of 12 inches.
basic information
- Lineup compatible with 2-12 inches - Wafer alignment possible in as short as 4.9 seconds - Correction operations for wafer center and angle can be performed simultaneously, achieving a repeatability accuracy of ±0.1 mm - Cleanliness Class 1
Price range
Delivery Time
Model number/Brand name
HIWIN Wafer Transport Robot DD Motor Aligner
Applications/Examples of results
Alignment in the semiconductor industry (wafers), LED industry (sapphire substrates), and optoelectronics industry (glass), etc.
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Download All CatalogsNews about this product(11)
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39th InterNepCon Japan / Electronics Manufacturing and Assembly Exhibition [HIWIN]
We will be exhibiting at the "39th Internepcon Japan/Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight from January 22, 2025. ◇ Event Period January 22 (Wed) to 24 (Fri), 2025, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2 E11-8 ◇ Featured Exhibits ■ N2 Nano Precision Stage A precision stage capable of positioning at the nanoscale. Ideal for the semiconductor industry, which requires high precision! Positioning stability is ±2nm. High-speed stability at 100mm/s is ±0.1%. With a low-profile and stable structure, it can be utilized in high-end precision inspection equipment. Our company develops, proposes, sells, and maintains a wide range of products, including linear motion products with world-class market share, precision instruments related to motion control, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, wafer transport systems, and ultra-thin DDD motors, which are optimal for the semiconductor industry.
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SEMICON Japan 2024【HIWIN】
We will be exhibiting at "SEMICON Japan 2024," which will be held at Tokyo Big Sight from December 11, 2024. ◇ Event Dates December 11 (Wednesday) to 13 (Friday), 2024, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 2, 2310 ◇ Featured Exhibits ■ Semiconductor Subsystem Solutions In addition to our direct drive products, which boast a world-class market share, we develop, propose, sell, and maintain a wide range of products related to motion control, precision machinery, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, as well as wafer transport systems, which are optimal for the semiconductor industry. 【First Exhibition in Japan】N2 Nano Precision Stage A precision stage capable of nanometer-scale positioning, ideal for the semiconductor industry where high precision is required! The nano positioning stage features a stable structure and includes software solutions that enhance servo control capabilities and equipment accuracy at the nanometer level.
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Photonix / Light and Laser Technology Exhibition - Exhibition Announcement [HIWIN]
We will be exhibiting at the "Photonix / Light and Laser Technology Exhibition" held at Makuhari Messe from October 29, 2024. ◇ Event Period October 29 (Tuesday) to October 31 (Thursday), 2024, 10:00 AM to 6:00 PM *On the final day, until 5:00 PM only. ◇ Exhibition Venue Makuhari Messe ◇ Booth Number Hall 1, 3-40 ◇ Featured Exhibits ■ Semiconductor Subsystem Solution Our company develops, proposes, sells, and maintains a wide range of products, including precision equipment related to motion control and industrial robots, in addition to direct drive products that boast a world-class market share. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical component parts such as stainless steel linear guideways and ball screws, which are optimal for the semiconductor industry, as well as wafer transport systems. The wafer transport system is equipped with a double-arm wafer transport robot and a wafer aligner. It is a compact model that contributes to improved space efficiency and work efficiency.
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Manufacturing Fair 2024【HIWIN】
We will be exhibiting at the "Monozukuri Fair 2024," which will be held at Marine Messe Fukuoka from October 16, 2024. ◇ Event Period October 16 (Wed) to 18 (Fri), 2024, 10:00 AM to 5:00 PM * The last day will end at 4:00 PM. ◇ Exhibition Venue Marine Messe Fukuoka ◇ Booth Number Hall A, No. AE-02 ◇ Featured Exhibits ■ Semiconductor Subsystem Solution Our company develops and manufactures a wide range of products from mechanical component parts to mechatronic products. We will showcase stainless steel linear guideways "MG Series" and ball screws "Super S Series," which are suitable for the semiconductor and FPD industries, as well as EFEM, wafer aligners, and ultra-precision stages at the nano level. At this exhibition, we will present mechanical component parts such as stainless steel linear guideways, which are optimal for the semiconductor industry, and wafer transport systems. The wafer transport system features a double-arm wafer transport robot and a wafer aligner. It is a compact model that contributes to improved work efficiency.
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Notice of Participation in the 25th Implementation Process Technology Exhibition / JISSO PROTEC 2024【HIWIN】
We will be exhibiting at the "25th Jisso Process Technology Exhibition / JISSO PROTEC 2024," which will be held at Tokyo Big Sight from June 12 to June 14, 2024. ◇ Event Period June 12 (Wednesday) to June 14 (Friday), 2024, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 4, 4C-20 ◇ Featured Exhibits ■ Semiconductor Subsystem Solution Our company develops, proposes, sells, and maintains a wide range of products, including linear motion products with a world-leading market share, precision equipment related to motion control, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, which are optimal for the semiconductor industry, as well as wafer load/unload systems. The wafer load/unload system features a double-arm wafer transport robot and a wafer aligner. This compact model contributes to improved space efficiency and work efficiency.