Notice of Participation in the 25th Implementation Process Technology Exhibition / JISSO PROTEC 2024【HIWIN】

ハイウィン

We will be exhibiting at the "25th Jisso Process Technology Exhibition / JISSO PROTEC 2024," which will be held at Tokyo Big Sight from June 12 to June 14, 2024. ◇ Event Period June 12 (Wednesday) to June 14 (Friday), 2024, 10:00 AM to 5:00 PM ◇ Exhibition Venue Tokyo Big Sight ◇ Booth Number East Hall 4, 4C-20 ◇ Featured Exhibits ■ Semiconductor Subsystem Solution Our company develops, proposes, sells, and maintains a wide range of products, including linear motion products with a world-leading market share, precision equipment related to motion control, and industrial robots. At this exhibition, we will propose subsystems that go beyond components for the semiconductor, LED, and FPD industries. We will showcase mechanical components such as stainless steel linear guideways and ball screws, which are optimal for the semiconductor industry, as well as wafer load/unload systems. The wafer load/unload system features a double-arm wafer transport robot and a wafer aligner. This compact model contributes to improved space efficiency and work efficiency.

Highwin Electronic Equipment Total Solution Exhibition 2024 / JISSO PROTEC 2024 Exhibition

High-performance, high-rigidity wafer transport robot

Date and time Wednesday, Jun 12, 2024 ～ Friday, Jun 14, 2024
10:00 AM ～ 05:00 PM
Capital Tokyo Big Sight, East Hall 4, 4C-20
Entry fee Charge Admission fee: 1,000 yen (tax included), free with prior web registration. Please register using the details and application button below.

Related product information

HIWIN Wafer Handling Robot [E Series]
High precision & high rigidity! Wafer transport robot compatible with 2-12 inch wafers [E Series]

Single Arm / Double Arm Arm Length: 135mm / 165mm / 185mm The end effector supports vacuum suction, gripping, and inverting methods.
HIWIN Wafer Aligner
Achieving high speed, high precision, high rigidity, high efficiency, and space-saving! The 【HIWIN Wafer Aligner】 compatible with 2-12 inches.

- Lineup compatible with 2-12 inches - Wafer alignment possible in as short as 4.9 seconds - Correction operations for wafer center and angle can be performed simultaneously, achieving a repeatability accuracy of ±0.1 mm - Cleanliness Class 1
Equipped with an absolute encoder: Next-generation DD motor
Reduction of development and maintenance man-hours! A next-generation DD motor that enables high-efficiency work without the need to return to the starting point.

【Equipped with Absolute Encoder】Features of Next-Generation DD Motor - Backlash-free and maintenance-free due to direct drive system - Achieves high-precision positioning control - High load capacity due to high-rigidity bearings - Improved work efficiency due to high-speed rotation capability - No need for origin return operation or control program - Allows for quick device restart during emergency stops or startup - Outer rotor type matches high inertia loads - Hollow shaft design makes wiring routing and spatial design easy - Compact design for rotation and movement structure
DD Motor
For various automation tasks. Hiwin's DD motor.

For details, please refer to the catalog or contact us.
DD motor - torque motor
■■Active in various automation tasks■■ HIWIN's direct drive DD motors and torque motors

For details, please refer to the catalog or contact us.