カタログ
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[Information] AI × Rule-Based Hybrid Image Processing Proposal for High-Level Automated Conveying Technology
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"Free Angle Multi-Surface Inspection Device" Brochure
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37th Electro Test Japan <Introduction of Exhibited Equipment>
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Wafer chip appearance inspection device (after dicing)
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Appearance inspection equipment for optical communication / high-frequency components, devices, and modules.
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Stereo camera system high-speed + high-resolution 3D inspection system
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Proposal for products that accommodate ultra-small and thin electronic components or large-scale components.
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High-performance desktop appearance inspection machine
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"High-Speed Component Transfer Machine" Aligns small electronic components and high-function modules in a disassembled state!
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Automotive chip component 6-face + 4-edge appearance inspection device
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Fine Products High-Speed and High-Precision Counting Machine 'HMS Series'
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Ceramic parts six-sided appearance inspection device (with tray packing function)
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"Low-cost version" wafer and chip appearance inspection device
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Tray packing function equipped six-sided appearance inspection device
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[Chip Component Alignment] 2-Sided Appearance Inspection Device
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Exhibition Participation Notice: "High-Speed Transfer Machine with Rotary Mount Head" and others.
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Tray packing function equipped two-sided appearance inspection device
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