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Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels. The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip rejection function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Rejection time: 3 to 6 chips/second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips/second for in-car applications

We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.

Thank you very much for using the website of Hubrain Inc. We would like to inform you that we have renewed our website. In this renewal, we have completely revamped the structure and design to make it easier for everyone to find the information they need. We will continue to strive to provide useful information and enhance our content for all users. We appreciate your continued support. Business Activities - Wafer and chip appearance inspection equipment - Tray packing machine with front and back inspection functions - Tray-type component appearance inspection machine - Tray-type appearance inspection machine - parallel processing type - Green sheet appearance inspection machine - parallel processing type - Chip component six-sided image inspection machine - PV module appearance inspection machine - PV cell appearance inspection machine - OPC drum surface defect inspection equipment - Pellet and powder foreign matter inspection equipment - Sheet appearance inspection - Container outer surface printing inspection - Container inner surface inspection machine - Multifunctional image inspection machine - Plastic syringe inspection equipment, etc.

We would like to provide information about the Kyushu Sales Office of Hubrain Co., Ltd. We are available for consultations regarding exterior inspection equipment and image processing. We can conduct evaluation tests of your work, and sample evaluation tests can be performed in the presence of the customer. Additionally, we can provide live demonstrations of the image inspection equipment, allowing you to see, touch, and experience Hubrain's actual devices. We will make suitable proposals tailored to your needs. The sales office is equipped with demonstration facilities. We look forward to your visit. You can find more detailed information in the related catalog.

Hubbrain Inc. will exhibit three products at the "34th Electro Test Japan" held at Tokyo Big Sight. The "Smart Transfer Machine," which allows for the transfer of massless micro and ultra-thin components into pockets of ceramic or metal porous plates under positive pressure, without causing any damage such as scratches or chipping that would occur with conventional vibration transfer machines. The "Smart Hopper," which feeds micro components into a container and controls the number of components flowing out from the tip of the container to the next process by adjusting air pressure and the inclination of the container. We will also showcase the "Stereo Camera-Based 3D Inspection Device," a practical ON-LINE type 3D inspection device using stereo-configured color line cameras. We sincerely look forward to your visit.