Wafer appearance inspection equipment *Functions can be selected according to the inspection content!
A wafer appearance inspection device capable of high-precision inspection with the selection of functions tailored to the inspection content and a wide range of optional features.
We would like to introduce our "Wafer Appearance Inspection System." This system can inspect appearance defects that occur during the wafer process at high speed and with high precision. The inspection targets include LSI, LD, Di, LED, power semiconductors, compound semiconductors, and MEMS. Examples of defects inspected include chipping, cracking, scratches, pattern anomalies, foreign objects, coating defects, and misalignment. 【Features】 ■ Functions can be selected according to inspection requirements - Micro inspection, macro inspection - Color inspection, monochrome inspection - Area camera, line camera - Surface inspection, front and back inspection ■ High-precision inspection is possible with a wide range of optional features *For more details, please download the PDF or feel free to contact us.
basic information
[Optional Features] ■ Area Camera Autofocus Function ■ Line Camera Autofocus Function ■ Differential Interference Inspection ■ AI Defect Classification Function ■ Warped Wafer Transport *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Purpose】 ■Inspection of appearance defects occurring in the wafer process *For more details, please download the PDF or feel free to contact us.*
