[Newsletter Sent] Image resolution can be selected! Wafer chip appearance inspection device (after dicing) / Hubrain Inc.
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Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels. The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip rejection function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Rejection time: 3 to 6 chips/second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips/second for in-car applications
