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  • SEMINAR_EVENT

We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.

ヒューブレイン

ヒューブレイン

We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.

  • Date and time Wednesday, Jan 25, 2023 ～ Friday, Jan 27, 2023
    10:00 AM ～ 05:00 PM
  • Capital Tokyo Big Sight East Hall 2, Booth: 16-48
  • Entry fee Free You need to apply for an invitation ticket to the exhibition (free of charge).

Related product information

  • Selectable image resolution! Wafer chip appearance inspection device (after dicing)

    Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.

    【Device Specifications (Example)】 ■Camera 　・3CMOS Color Area Camera with 3.2 Megapixels (Inspection) 　・16,000 Pixel Monochrome Line Camera (Press Can) ■Device Size 　・1,450W × 1,640D × 1,800H mm 　・Excluding Patlite and HEPA *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer Appearance Inspection Equipment (Before Dicing)

    Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.

    【Specifications (Example)】 ■Camera 　・5 million pixel monochrome area camera (micro inspection) 　・12 million pixel monochrome area camera (macro inspection) 　・25 million pixel monochrome area camera (alignment) ■Device Size 　・1,350W × 1,350D × 1,800H mm 　・Excluding patrol light and HEPA filter *For more details, please refer to the PDF document or feel free to contact us.

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Wafer chip appearance inspection device (after dicing)

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Wafer Appearance Inspection Device (Before Dicing)

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