We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.

Hubbrain Inc. will exhibit three products at the "34th Electro Test Japan" held at Tokyo Big Sight. The "Smart Transfer Machine," which allows for the transfer of massless micro and ultra-thin components into pockets of ceramic or metal porous plates under positive pressure, without causing any damage such as scratches or chipping that would occur with conventional vibration transfer machines. The "Smart Hopper," which feeds micro components into a container and controls the number of components flowing out from the tip of the container to the next process by adjusting air pressure and the inclination of the container. We will also showcase the "Stereo Camera-Based 3D Inspection Device," a practical ON-LINE type 3D inspection device using stereo-configured color line cameras. We sincerely look forward to your visit.

Hubbrain Inc. will be exhibiting at "ElectroTest Japan," held concurrently with "InterNepcon Japan" at Tokyo Big Sight from January 16 to 18, 2019. 【Exhibition Overview】 ElectroTest Japan features major manufacturers of various inspection and testing equipment, including appearance and X-ray inspection devices, testers, environmental and reliability testing equipment, and various analytical devices. It has established itself as a venue for business negotiations with domestic and international manufacturers of electronic devices, semiconductors, electronic components, and automotive and electrical products. We look forward to your visit. *You can download a PDF with detailed information from the related materials.

Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.

Hubbrain Inc. will exhibit at "SEMICON JAPAN 2018," which will be held at Tokyo Big Sight from December 12 to 14, 2018. 【Exhibition Overview】 SEMICON Japan is an international exhibition covering the entire electronics manufacturing supply chain, from the front-end to the back-end of semiconductor processes, as well as SMART applications such as automotive and IoT devices. Over 750 exhibitors will showcase cutting-edge manufacturing technologies, attracting nearly 70,000 participants from Japan and around the world over the three days. SEMICON Japan offers participants new encounters and business opportunities – a magic experience. We look forward to your visit.