Wafer Appearance Inspection Equipment (Before Dicing)
Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.
The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications (Example)】 ■Camera ・5 million pixel monochrome area camera (micro inspection) ・12 million pixel monochrome area camera (macro inspection) ・25 million pixel monochrome area camera (alignment) ■Device Size ・1,350W × 1,350D × 1,800H mm ・Excluding patrol light and HEPA filter *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Inspection Items】 ■ Scratches, discoloration, foreign substances, pattern misalignment, pattern defects, residual resist, coating defects, etc. *For more details, please refer to the PDF document or feel free to contact us.
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