Wafer chip appearance inspection device
Simultaneous inspection of front and back possible! A wafer and chip appearance inspection machine that can perform both macro and micro inspections with one unit. Suitable for LED and semiconductor chips.
The "Wafer Chip Appearance Inspection System HM-256 Series" features a standard 3CMOS 3.2 million pixel color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer and dicing processes. It can inspect appearance defects that occur during the wafer and dicing processes with high speed and precision, allowing for the inspection of various chip patterns. 【Features】 ■ Inspection with variable image resolution (1.5 to 5µ) for each type ■ Inspection at sub-micron resolution possible with an embedded microscope (optional) ■ Defect classification based on complex conditions of image features ■ Inspection using multiple recipes (different image resolutions, lighting, and judgment programs) in a single run *For more details, please download the catalog or feel free to contact us.
basic information
【Features】 ○ Capable of inspecting appearance defects generated in the wafer process and dicing process quickly and with high precision. ○ Capable of inspecting a variety of chip patterns. ○ Inspection possible with variable image resolution (1.5 to 5µ) for each type. ○ Inspection possible at sub-micron resolution using an embedded microscope (optional). ○ Defects can be classified based on complex conditions of image features. ○ Inspection can be performed using multiple recipes (different image resolutions, lighting, and judgment programs) in one go. ○ Equipped with an auto-loader for continuous supply and a high-speed NG chip elimination mechanism. ○ Capable of inspecting and eliminating workpieces with a thickness tolerance of 150µm (with high-speed height measurement and height correction function). ○ Function for checking elimination mistakes and marking mistakes for all items (optional). ○ Capable of backside inspection through the sheet (optional). ○ NG marking (ink or laser marker) and automatic barcode reading are possible (optional). ○ There is also a low-cost type HS-256G that does not include an auto-loader or elimination mechanism. 【For more details, please download the catalog or feel free to contact us.】
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Inspection Target Work】 ○ LED chips, laser chips, and other semiconductor chips (Chip size: 100µm and above, compatible with various patterns) ○ Wafer size: 2 to 8 inches (possible within an inspection range of up to 210mm) ○ Compatible with various rings and cassettes ● For more details, please contact us or refer to the catalog.
