"Low-cost version" wafer chip appearance inspection device
It is possible to inspect appearance defects occurring in the wafer process and dicing process quickly and with high precision.
The "Low-Cost Version Wafer and Chip Appearance Inspection System HMWF-A2000" is an appearance inspection device equipped with a high-resolution color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer processing and dicing. It can inspect appearance defects occurring in the wafer and dicing processes with high speed and precision, and is capable of inspecting a variety of chip patterns. 【Features】 ■ Capable of inspecting a variety of chip patterns. ■ Can capture features for each defect item through image processing and classify defects (categorization function). ■ The accumulated software technology significantly reduces the total cost of the device. *For more details, please contact us or download the catalog to view.
basic information
(Optional Specifications) - Compatible with loader/unloader - Compatible with NG chip elimination mechanism - Capable of inspection while performing height correction - Compatible with marking mechanism for NG areas - Compatible with confirmation mechanism for discharge and marking errors - Compatible with 2D code reading mechanism - Correction function for unstable workpiece positioning during supply - Input/output of MAP data *For more details, please contact us or download and view the catalog.
Price range
Delivery Time
Applications/Examples of results
【Inspection Target Work】 ○ Semiconductor chips such as LED chips and laser chips (Chip size: 100µm and above, compatible with various patterns) ○ Wafer size: 2 to 8 inches (possible within a maximum inspection range of 210mm) ○ Compatible with various rings and cassettes ● For more details, please contact us or refer to the catalog.
