Introduction of products under development
At Hubrain, we are developing products that support the inspection of electronic components for miniaturization, thinning, or enlargement.
<Product Overview> Component-1. Smart Hopper Component-2. Floating Transfer Machine Component-3. Plate Type PF Component-4. Porous LF System-1. Bulk Work Transfer Device System-2. High-Speed Inspection Device with 6 Sides + 4 Long Edge We would like to listen to your requests and work on creating products that better meet your needs. Please feel free to share your opinions and requests with us!
basic information
Component-1: Smart Hopper High-speed transport of ultra-small parts below 0603 with minimal "chocolate stops." Accurate quantity counting is possible. Component-2: Floating Transfer Machine Uses a porous plate instead of a vibration method, allowing for high-speed transfer without damaging the workpiece. Component-3: Porous Plate Type PF A PF without a bowl. It can align and transport workpieces with no mass or extremely thin workpieces. Component-4: Porous Plate Type LF LF using ceramic porous material. The workpiece moves under the force of positive pressure, reducing contact with the underside. System-1: Bulk Workpiece Transfer Device Transfers bulk workpieces directly to sheets, trays, substrates, or embossed carrier tapes after visual inspection of two surfaces. System-2: High-Speed Visual Inspection Device for 6 Surfaces + 4 Long Edges Capable of inspecting easily damaged edge areas. Achieves gentle transport that minimizes damage even for large products.
Price information
(The following are the planned selling prices) Component-1. Smart Hopper 1.3 million yen Component-2. Floating Leveling Machine, Transfer Machine Leveling Machine 1 million yen ~ Transfer Machine 3 million yen ~ Component-3. Plate Type PF 800,000 to 1 million yen Component-4. Porous LF 800,000 yen System-1. Bulk Work Transfer Device 12 to 30 million yen System-2. 6-Sided + Long Edge 4-Edge High-Speed Inspection Device 24 million yen
Delivery Time
Applications/Examples of results
Developed to accommodate extremely small electronic components, as well as thinner or larger sizes (No weight-bearing work) - Transporting micro work below 0402 and ultra-thin work with a thickness of less than 20 without relying on vibration. (Large products) - Transporting large work exceeding 5mm x 5mm at high speed without causing damage. (High-speed processing) - In the transport section, instead of using a pick-up nozzle method that has a tactical limit, processing is done collectively. - In visual inspection, since it does not use the pick-up nozzle method, simultaneous processing of multiple items is possible, leading to increased productivity. - The transport section has a wide range of dual-use capabilities, significantly reducing the effort required for setup changes.
