High-speed + high-resolution 3D inspection system using stereo camera method (※Video available)
Achieving a high-speed, high-resolution 3D inspection system!
■7000 pixel color line camera specifications ■3D variation example: height resolution of 0.55μm, horizontal resolution of 5μm, achieving a scan speed of 106mm/s with a field of view size of 35mm ■Based on 2D color image data captured simultaneously with 3D, we have incorporated our original image inspection software to also perform color image inspection ■A 3D+2D inspection device systematized by integrating it into a transport device tailored to customer specifications at our own factory, in collaboration with Chromasens.
basic information
■7000 pixel color line camera specifications ■3D variation example: height resolution of 0.55μm, horizontal resolution of 5μm, achieving a scan speed of 106mm/s with a field of view size of 35mm ■Based on 2D color image data captured simultaneously with 3D, we have incorporated our original image inspection software to also perform color image inspection ■A 3D+2D inspection system integrated with a transport device customized to customer specifications, developed in collaboration with Chromasens at our own factory
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Delivery Time
Applications/Examples of results
- Ceramic substrate ⇒ Pattern film thickness, gentle unevenness, via depth, substrate warpage, adhesion - BGA bump ⇒ Height, diameter, coplanarity - Connector ⇒ Terminal flatness, resin shrinkage - Lead frame ⇒ Inner lead coplanarity - Others ⇒ Surface scratches on film/glass/resin molded products/press molded products/forged products, gentle unevenness - Semiconductor ⇒ Wire bonding, lifting from pad area, height anomalies, etc.
