Reflow tin plating
Reflow tin plating that accommodates high-density mounting with whisker risk reduction.
In high-density mounting that responds to the miniaturization and high functionality of electronic components, measures to prevent the occurrence of whiskers (needle-like metal crystals) that cause circuit short circuits are a concern. Reflow tin plating can reduce the risks associated with whiskers. Specifications for materials that can be reflow tin plated are as follows: Material: Copper, copper alloys, SUS; full plating: thickness 0.8–1.2mm, width 10–300mm; partial plating: thickness 0.15–0.8mm, width 10–65mm; wire plating: size 0.35–1.2mm, round wire, square wire (flat square wire is also available); base materials: copper, nickel. For more details, please contact us or refer to the catalog.
basic information
【Features】 ○ In high-density mounting that responds to the miniaturization and high functionality of electronic components, measures against the occurrence of whiskers (needle-like metal crystals), which can cause circuit shorting failures, are a concern. → Risk from whiskers can be reduced. 【Specifications for Reflow Solderable Materials】 ○ Material: Copper, Copper Alloys, SUS ○ Full plating: Thickness 0.8–1.2mm, Width 10–300mm ○ Partial plating: Thickness 0.15–0.8mm, Width 10–65mm ○ Wire plating: Size 0.35–1.2mm, Round wire, Square wire (flat square wire also available) ○ Base material types: Copper, Nickel ● For more details, please contact us or refer to the catalog.
Price information
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Applications/Examples of results
【Purpose】 ○ In high-density mounting that responds to the miniaturization and high functionality of electronic components, measures against the occurrence of whiskers (needle-like metal crystals), which can cause short circuit failures in circuits, become an issue. → Reflow tin plating can reduce the risk associated with whiskers. ● For more details, please contact us or refer to the catalog.
