Comprehensive Catalog of Continuous Plating Processing

Efficient plating treatment for materials wound in a coil shape! [Prototype support available!]

Hygent's "functional plating" is characterized by efficiently applying plating treatment to coiled metal materials and pressed materials in a continuous process. We have a variety of processing lines for continuous plating, allowing us to respond quickly to needs and requests. Please feel free to consult us about prototypes. 【Types of Plating】 ■ "Tin plating" suitable for connector terminals, etc. ■ "Reflow tin plating" that reduces risks from whiskers ■ "Nickel plating" suitable for aluminum wire bonding ■ "Gold plating" that contributes to core functions of safety devices ■ "Silver plating for semiconductors" that is perfect for soldering, etc. *For more details, please download the catalog or contact us. *Those who apply for the comprehensive catalog will receive the latest version in 2024.

basic information

【Features of Each Plating】《Tin Plating》 Wide applications in automotive connectors, industrial, and consumer products. ■ Specifications for materials that can be tin plated Material: Copper, copper alloys, SUS, 42 alloy, iron, aluminum Full plating: Thickness 0.08–2.5mm / Width 8–300mm Partial plating: Thickness 0.1–2.5mm / Width 10–100mm ■ Types of substrates Copper, nickel 《Reflow Tin Plating》 Supports high-density mounting with reduced risk of whiskers. ■ Specifications for materials that can be reflow tin plated Material: Copper, copper alloys, SUS Full plating: Thickness 0.8–1.2mm / Width 10–300mm Partial plating: Thickness 0.15–0.8mm / Width 10–65mm ■ Types of substrates Copper, nickel