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Cushion material for printed circuit board manufacturing "ACE BOARD(R)"
Cushioning material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.
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Aluminum extrusion felt "THERMOTEX(R)"
A rich lineup tailored to the temperature and transportation form of aluminum extruded materials!
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Felt for steel plates (roll cover for galvanized line) *Materials available!
By adding more felt to the contact area (crown part), it is also possible to extend its lifespan!
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Cushion material "ACE BOARD X・CX Series"
For printed circuit board manufacturing! Recommended for FR-4, BT resin, and PPE boards, etc.
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Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"
Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport through suction.
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Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"
The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.
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