Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"
The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.
The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300℃ to 500℃ or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650℃. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300℃ to 500℃ or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Product Lineup】 ■KG0331A4G ■KG0331C3G *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
