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【2025年9月17日(水)~19日(金)】『第4回ネプコンジャパン秋 エレクトロニクス開発・実装展』出展のお知らせ
当社は、幕張メッセにて開催される『第4回ネプコンジャパン秋 エレクトロニクス開発・実装展』に出展いたします。 本展はエレクトロニクス機器の多機能化・高性能化を支える先端の 電子部品・材料や製造・実装・検査装置が出展する展示会です。 国内外のエレクトロニクス、半導体・センサ、電子部品、自動車・ 電装品メーカーとの商談の場として定着しています。 皆様のご来場を、心よりお待ちしております。
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Notice of participation in the JPCA Show 2024 from June 12 (Wednesday) to June 14 (Friday), 2024.
Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at the "JPCA Show 2024" held at Tokyo Big Sight. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, 'ACE BOARD.' This product combines high heat resistance and lasting cushioning properties, and is used in high-temperature press molding of printed circuit boards and building materials. It is widely used in the production of printed circuit boards for rapidly advancing communication standards (5G), IoT, and autonomous driving. We sincerely look forward to your visit.
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Notice of participation in 'Nepcon Japan [Autumn]' from September 13 (Wednesday) to September 14 (Friday), 2023.
Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at "Nepcon Japan [Autumn]" held at Makuhari Messe. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, 'ACE BOARD.' This product is used in high-temperature press molding of printed circuit boards and building materials, combining high heat resistance with lasting cushioning properties. It is widely used in the production of printed circuit boards for rapidly advancing communication standards (5G), IoT, and autonomous driving. We sincerely look forward to your visit.
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Notice of participation in the 'JPCA Show 2023' from May 31 (Wednesday) to June 2 (Friday), 2023.
Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at the "JPCA Show 2023" held at Tokyo Big Sight. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, "ACE BOARD." This product combines high heat resistance and sustained cushioning properties, used in high-temperature press molding of printed circuit boards and building materials. It is widely used in the production of printed circuit boards for rapidly advancing communication standards such as 5G, IoT, and autonomous driving. We sincerely look forward to your visit.