イチカワテクノファブリクス 　 Official site

We will be exhibiting at the "4th Neppon Japan Autumn Electronics Development and Implementation Exhibition" held at Makuhari Messe. This exhibition showcases advanced electronic components, materials, and manufacturing, implementation, and inspection equipment that support the multifunctionality and high performance of electronic devices. It has established itself as a venue for business discussions with domestic and international electronics, semiconductor, sensor, electronic component, and automotive and electrical equipment manufacturers. We sincerely look forward to your visit.

Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at the "JPCA Show 2024" held at Tokyo Big Sight. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, 'ACE BOARD.' This product combines high heat resistance and lasting cushioning properties, and is used in high-temperature press molding of printed circuit boards and building materials. It is widely used in the production of printed circuit boards for rapidly advancing communication standards (5G), IoT, and autonomous driving. We sincerely look forward to your visit.

Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at "Nepcon Japan [Autumn]" held at Makuhari Messe. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, 'ACE BOARD.' This product is used in high-temperature press molding of printed circuit boards and building materials, combining high heat resistance with lasting cushioning properties. It is widely used in the production of printed circuit boards for rapidly advancing communication standards (5G), IoT, and autonomous driving. We sincerely look forward to your visit.

Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at the "JPCA Show 2023" held at Tokyo Big Sight. At this exhibition, we plan to showcase our high-performance heat-resistant cushioning material, "ACE BOARD." This product combines high heat resistance and sustained cushioning properties, used in high-temperature press molding of printed circuit boards and building materials. It is widely used in the production of printed circuit boards for rapidly advancing communication standards such as 5G, IoT, and autonomous driving. We sincerely look forward to your visit.