Cushion material for printed circuit board manufacturing "ACE BOARD(R)"
Cushion material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.
"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made from high-heat-resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases 【Exhibition Information】 ■ Exhibition Name: New Functional Materials Exhibition 2026 ■ Venue: Tokyo Big Sight, West Exhibition Hall ■ Booth Number: 3W-F25, 3W-F28 (within the Japan Nonwoven Fabrics Association booth) ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line "Kokusai Tenjijo" Station, about a 7-minute walk - Yurikamome "Tokyo Big Sight" Station, about a 3-minute walk *For more details, please download the PDF or contact us. Samples are also available.
basic information
【Lineup】 ■ Ace Board C, X, CX Series: Up to 300℃ ■ Ace Board Z Series: Up to 400℃ *For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
Cushion material for printed circuit board manufacturing *For more details, please download the PDF or contact us.
Related Videos
catalog（1）
Download All Catalogs
News about this product（2）
-
Notice of Participation in the "New Functional Materials Exhibition 2026" from January 28 (Wednesday) to January 30 (Friday), 2026.
Ichikawa Techno Fabrics Co., Ltd. will be exhibiting at the "New Functional Materials Exhibition 2026" held at Tokyo Big Sight. This exhibition will bring together many products and technologies essential for manufacturing, from materials to processing and devices. Numerous visitors with specific needs seeking solutions to various challenges will attend. Collaboration proposals among exhibitors, as well as between visitors and exhibitors, will also be active. At our booth, we plan to showcase "industrial felt." We look forward to your visit.
-
Notice of Participation in the "4th Nepcon Japan Autumn Electronics Development and Implementation Exhibition" from September 17 (Wednesday) to September 19 (Friday), 2025.
We will be exhibiting at the "4th Neppon Japan Autumn Electronics Development and Implementation Exhibition" held at Makuhari Messe. This exhibition showcases advanced electronic components, materials, and manufacturing, implementation, and inspection equipment that support the multifunctionality and high performance of electronic devices. It has established itself as a venue for business discussions with domestic and international electronics, semiconductor, sensor, electronic component, and automotive and electrical equipment manufacturers. We sincerely look forward to your visit.
Distributors
Our company is a group company of Ichikawa Co., Ltd., which manufactures and sells felts for papermaking, felts for slate, and belts for papermaking, and we handle various types of industrial felts. The three main applications of our industrial felts are "cushioning," "conveying," and "protection/covering." We mainly deal with felts used in processes that require heat resistance, such as the heat-resistant cushioning material for printed circuit board manufacturing, "ACE BOARD(R)," felts for aluminum extrusion, and felts for steel plate plating lines. Please feel free to contact us if you have any inquiries.