Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"
The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.
The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Product Lineup】 ■KG0331A4G ■KG0331C3G *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a group company of Ichikawa Co., Ltd., which manufactures and sells felts for papermaking, felts for slate, and belts for papermaking, and we handle various types of industrial felts. The three main applications of our industrial felts are "cushioning," "conveying," and "protection/covering." We mainly deal with felts used in processes that require heat resistance, such as the heat-resistant cushioning material for printed circuit board manufacturing, "ACE BOARD(R)," felts for aluminum extrusion, and felts for steel plate plating lines. Please feel free to contact us if you have any inquiries.