Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport via suction.

The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It possesses both cushioning and thermal conductivity properties, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity properties ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Specifications】 ■Model Number: KG0355 Series ■Weight: 600g/m2 to 2,000g/m2 ■Thickness: 3.0mm to 6.0mm ■Surface Material: None, heat-resistant paper, heat-resistant film *For more details, please refer to the PDF document or feel free to contact us.