カタログ
電子ブック詳細の閲覧にはアンケート回答が必要です
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Narrowing down defective areas using the EBAC (Absorption Current) method.
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Evaluation of membrane quality using EELS analysis method
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Observation of diffusion layers in semiconductors using FIB-SEM.
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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.
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Failure analysis of an orange LED damaged by electrostatic discharge.
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OBIRCH analysis of SiC devices using short-wavelength lasers.
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Surface mount electronic component cross-sectional observation service
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Cross-sectional polishing service for implementation parts and electronic components.
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[Contract Analysis] Laser Microscope (Observation & Measurement)
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[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)
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Cross-section polishing (CP) method for cross-sectional observation service.
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Crystal analysis by EBSD: Intermetallic compounds in solder joints
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[Example of Analysis by EBSD] High Melting Point Solder
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Observation of time-dependent changes associated with reliability testing.
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