We exhibited at the Microelectronics Show eX-Tech 2026, held concurrently with the JPCA Show 2026, an exhibition of electronic circuits and implementation technologies! Thank you very much for visiting our booth despite your busy schedule! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us using the inquiry form below.

Our company conducts specific surface area measurements of powdered zeolite using the BET method. In addition to powdered zeolite, it can also be used for specific surface area measurements of catalysts and activated carbon, and by utilizing other applications, it is possible to measure not only specific surface area but also pore distribution. Furthermore, particle size and pore distribution can be evaluated using methods and equipment other than those mentioned. For more details, please refer to our catalog.

Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*

Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.

This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.

This paper introduces the evaluation of thermally degraded rubber using dynamic viscoelastic measurements. A constant temperature chamber capable of circulating air within the chamber was used as a suitable device for thermal degradation testing, and NBR rubber and EPDM rubber were heated at 100°C for a specified time. The changes in viscoelastic behavior due to heating time were investigated. For both types of rubber, as the heating time increased, the tanδ (= E"/E') peak shifted towards higher temperatures, and a decrease in peak value was observed. It is believed that the loss of rubber elasticity and the decrease in elastic modulus resulted in the shift of Tg towards higher temperatures. By measuring dynamic viscoelasticity, it becomes possible to confirm the changes in physical properties associated with material degradation and to gain insights into structural changes. Additionally, conducting other chemical analyses can clarify more specific changes in chemical structure.

We exhibited at the "12th Seminar of the Advanced Power Semiconductor Subcommittee" held at the Toyama International Conference Center! Thank you very much for taking the time to visit our booth despite your busy schedule! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us through the inquiry form below.

We exhibited at the "45th Nano Testing Symposium (NANOTS2025)" held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! Thank you very much for taking the time to visit our booth! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us through the inquiry form below.

We will be exhibiting at the "43rd Nano Testing Symposium (NANOTS2023)" held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! We will be introducing our latest analytical technology services, so please stop by! We sincerely look forward to your visit.

We will be exhibiting at the "12th Conference of the Advanced Power Semiconductor Subcommittee" held at the Toyama International Conference Center. We will be introducing our latest analysis technology services, so please stop by! We sincerely look forward to your visit.

We exhibited at the 2nd "Kyushu Semiconductor Industry Exhibition" held at Marine Messe Fukuoka Hall A and B in Fukuoka City, Fukuoka Prefecture! Thank you very much for visiting our booth despite your busy schedule! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us using the inquiry form below.

Aites Co., Ltd. will be exhibiting at the 2nd "[Kyushu] Semiconductor Industry Exhibition" held at Marine Messe Fukuoka Hall A and B in Fukuoka City, Fukuoka Prefecture. We will be introducing our analysis technology services, so please feel free to stop by. We sincerely look forward to your visit.

Our company conducted a "moisture and heat resistance test for adhesives" to investigate changes in adhesive strength due to the effects of moisture and heat. Test specimens were placed in a constant temperature and humidity testing machine, and after 500 hours, they were removed to measure the tensile shear adhesive strength. It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high temperature and high humidity environment. We can conduct various environmental tests and strength tests on a wide range of materials, not just adhesives. Additionally, we also provide chemical analysis to clarify degradation mechanisms.

NMC (Li(NixMnyCoz)O2) is used as a positive electrode active material in lithium-ion batteries. Regarding the NMC reagent, an evaluation of the valence of metal oxides was conducted through state analysis using XPS. As a result of the analysis, the NiMnCo ratio obtained is close to the specifications of the reagent. Additionally, F and C, which are believed to originate from the binder component, have been detected.

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, suggesting that the undercoat layer may be exposed. Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and the resistive element appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface, and it is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive element to melt and the resistance value to change (leading to an open circuit).

To prevent shock and vibration, low-rebound and vibration-absorbing materials are used in various situations. The indicator of these properties is viscoelasticity. This document presents examples of evaluating the rebound and vibration absorption properties of rubber materials through dynamic mechanical analysis (DMA). From the dynamic viscoelasticity concerning temperature, it is possible to predict the vibration absorption and rebound properties of materials in their usage environment. From the dynamic viscoelasticity concerning frequency, it can be utilized to predict damping performance against seismic motion, braking performance of tires, and in the low-frequency range, it can be used to predict long-term deformation behavior such as creep.

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure locations using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure locations using TEM

This document introduces examples of visualizing the internal state of capsules in three dimensions and obtaining elemental information data through EDX analysis of powders. In the X-ray CT analysis, it was observed that there were slight air gaps inside the capsule, and it was also visually confirmed that the particle size was not uniform, with some larger particles present. In the SEM-EDX analysis, elemental analysis was conducted on any particles contained within. At an acceleration voltage of 15kV, carbon (C), oxygen (O), calcium (Ca), chlorine (Cl), iron (Fe), phosphorus (P), and sodium (Na) were detected. [Analysis Details] ■ X-ray CT Analysis: X-ray transmission observation of the capsule ■ SEM-EDX Analysis: Elemental analysis of any particles contained within

We would like to introduce the dynamic viscoelastic measurement of CFRP conducted by our company using the bending mode. When performing dynamic viscoelastic measurements using DMA, CFRP is generally highly elastic, and it is considered that measurements using the bending mode are suitable due to its applications. The deformation modes of DMA can measure in any mode as long as the size requirements are met, but it is ideal to select appropriate conditions based on the material's shape, elastic modulus, and the purpose of the measurement. If you have any subjects for which you would like to measure dynamic viscoelasticity, please feel free to consult us. 【Measurement Modes】 ■ Tensile ■ Compression ■ Bending (Two-point/One-point/Three-point) ■ Shear

This is a case study that compares the methods for cross-section preparation on the surface coating layer of a golf ball and observes the effects of heat from CP processing. There are two layers of coating on the outermost layer of the cover layer, and a comparison of cross-section preparation methods was conducted using this coating layer. SEM observations of the cross-sections prepared by three different methods were performed. While cross-section preparation of soft materials is effectively done using cross-section ion milling (CP), the physical properties may change due to the heat generated during CP processing. In such cases, cross-section preparation using cryo-CP, which mitigates the effects of processing heat through cooling, is effective. 【Cross-section preparation methods】 ■ Mechanical polishing ■ CP ■ Cryo-CP (-50℃)

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.

At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look.

This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.

We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

We would like to introduce the "Tensile Property Evaluation using Extensometers for High-Elasticity Flexible Materials" that we offer. Tensile tests of NR rubber will be conducted using contact-type (suitable for high-elasticity and soft materials) and non-contact type (video) extensometers, and the results will be compared. To accurately determine strain in tensile tests, it is necessary to select the appropriate extensometer and testing conditions based on the target material and measurement objectives. We will provide suggestions tailored to your consultation needs.

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to create specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the characteristics of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating.

Our "component analysis of organic substances" often utilizes FT-IR and GC/MS. In FT-IR measurements, it is possible to analyze the main components of organic substances by comparing the IR spectrum of known substances. Additionally, if you want to analyze not only the main components of unknown substances but also trace amounts of organic substances such as additives, we recommend conducting GC/MS measurements.

I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.

I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.