アイテス Official site

This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.

Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.

This paper introduces the evaluation of thermally degraded rubber using dynamic viscoelastic measurements. A constant temperature chamber capable of circulating air within the chamber was used as a suitable device for thermal degradation testing, and NBR rubber and EPDM rubber were heated at 100°C for a specified time. The changes in viscoelastic behavior due to heating time were investigated. For both types of rubber, as the heating time increased, the tanδ (= E"/E') peak shifted towards higher temperatures, and a decrease in peak value was observed. It is believed that the loss of rubber elasticity and the decrease in elastic modulus resulted in the shift of Tg towards higher temperatures. By measuring dynamic viscoelasticity, it becomes possible to confirm the changes in physical properties associated with material degradation and to gain insights into structural changes. Additionally, conducting other chemical analyses can clarify more specific changes in chemical structure.

We exhibited at the "12th Seminar of the Advanced Power Semiconductor Subcommittee" held at the Toyama International Conference Center! Thank you very much for taking the time to visit our booth despite your busy schedule! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us through the inquiry form below.

We exhibited at the "45th Nano Testing Symposium (NANOTS2025)" held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! Thank you very much for taking the time to visit our booth! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us through the inquiry form below.