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We exhibited at the Microelectronics Show eX-Tech 2026, held concurrently with the JPCA Show 2026, an exhibition of electronic circuits and implementation technologies! Thank you very much for visiting our booth despite your busy schedule! If you have any questions regarding the information provided, please feel free to contact our representative or reach out to us using the inquiry form below.

Our company conducts specific surface area measurements of powdered zeolite using the BET method. In addition to powdered zeolite, it can also be used for specific surface area measurements of catalysts and activated carbon, and by utilizing other applications, it is possible to measure not only specific surface area but also pore distribution. Furthermore, particle size and pore distribution can be evaluated using methods and equipment other than those mentioned. For more details, please refer to our catalog.

Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*

Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.

This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.