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Our company conducted a "moisture and heat resistance test for adhesives" to investigate changes in adhesive strength due to the effects of moisture and heat. Test specimens were placed in a constant temperature and humidity testing machine, and after 500 hours, they were removed to measure the tensile shear adhesive strength. It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high temperature and high humidity environment. We can conduct various environmental tests and strength tests on a wide range of materials, not just adhesives. Additionally, we also provide chemical analysis to clarify degradation mechanisms.

Aites Co., Ltd. will be exhibiting at the 2nd "[Kyushu] Semiconductor Industry Exhibition" held at Marine Messe Fukuoka Hall A and B in Fukuoka City, Fukuoka Prefecture. We will be introducing our analysis technology services, so please feel free to stop by. We sincerely look forward to your visit.

NMC (Li(NixMnyCoz)O2) is used as a positive electrode active material in lithium-ion batteries. Regarding the NMC reagent, an evaluation of the valence of metal oxides was conducted through state analysis using XPS. As a result of the analysis, the NiMnCo ratio obtained is close to the specifications of the reagent. Additionally, F and C, which are believed to originate from the binder component, have been detected.

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant circuit board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, suggesting that the undercoat layer may be exposed. Next, a cross-sectional sample was prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which showed that the protective film and the resistive element appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface, and it is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive element to melt and the resistance value to change (leading to an open circuit).

To prevent shock and vibration, low-rebound and vibration-absorbing materials are used in various situations. The indicator of these properties is viscoelasticity. This document presents examples of evaluating the rebound and vibration absorption properties of rubber materials through dynamic mechanical analysis (DMA). From the dynamic viscoelasticity concerning temperature, it is possible to predict the vibration absorption and rebound properties of materials in their usage environment. From the dynamic viscoelasticity concerning frequency, it can be utilized to predict damping performance against seismic motion, braking performance of tires, and in the low-frequency range, it can be used to predict long-term deformation behavior such as creep.