Ultrasonic microscope observation of semiconductor packages

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This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.