[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy
If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!
Here is a case study of observing the adhesive state through a metal plate using an ultrasonic microscope. The ultrasonic microscope can confirm internal information that cannot be seen from the exterior, as long as the ultrasonic waves can penetrate. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion state between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.