All products and services
1～30 item / All 360 items
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Repeated decompression test
Repeatedly perform tests by reducing pressure and check the timing of leaks from the pressure data!
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Surface and cross-sectional analysis after scratch testing.
Understanding the internal destruction mechanisms near the surface that cannot be discerned through surface observation alone!
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Reliability evaluation and failure analysis of joints through power cycle testing.
We conduct contract testing using Siemens testing equipment! We can also handle the production of various necessary jigs.
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[Case Study] Analysis of Non-lighting in LED Lighting
A case study of conducting elemental analysis for migration elemental analysis and identifying the source of Ag generation!
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Ion analysis using ion chromatography.
Quantitative analysis of cation and anion components in aqueous solution! Also compatible with cleanliness testing of electronic substrates.
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Observation of wire bonding shapes
Introduction to wire bonding and other aspects of SOP (Small Outline Package) packages!
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TEM observation of PL emission sites in SiC.
Identification of defect locations and overall understanding by PL enables detailed observation of defect areas using TEM!
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Analysis of discoloration in gold plating using Auger electron spectroscopy.
Introducing a case study of discoloration analysis of gold-plated pads using Auger Electron Spectroscopy (AES)!
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Analysis of altered resin
How the IR spectrum and Raman spectrum change due to alteration! Introducing the spectrum of resin treated with heat in the air.
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Component analysis of the tape adhesive layer
Introducing analytical methods widely used for component analysis of polymer materials!
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Ultrasonic microscope observation of printed circuit boards.
Delamination inside the circuit board, which is not visible during visual inspection, can also be visualized!
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Measurement of specific surface area of powdered zeolite by the BET method.
Supports measurement of catalysts and activated carbon! Analysis of pore distribution is also possible.
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Confirmation of chiplet package structure by mechanical polishing.
Cross-sectional samples were created using X-ray CT observation and mechanical polishing, and structural confirmation was conducted!
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Ultrasonic microscope observation of semiconductor packages
Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.
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[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy
If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!
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Evaluation of thermal degradation rubber by DMA
Dynamic mechanical analysis (DMA) allows for the evaluation of the state from low to high temperatures.
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Moisture and heat resistance test for adhesive
Evaluation of adhesive strength in high temperature and high humidity environments! Chemical analysis (FT-IR, GCMS, etc.) is also available to elucidate the degradation mechanisms of materials.
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State analysis of cathode active materials using XPS.
For the evaluation of lithium-ion battery materials! Analyzing chemical bonding states using X-ray photoelectron spectroscopy.
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Example of failure analysis of chip resistors
We will introduce processing and observation methods using mechanical polishing, SEM, and EDX!
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Evaluation of the rebound and vibration absorption properties of rubber materials
Introduction of examples of "temperature dispersion measurement" and "frequency dispersion measurement - master curve."
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Specification verification and failure analysis through reliability testing.
Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!
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Industrial PC Repair Service
To customers who are troubled because the manufacturer's support period has ended!
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Solar cell PL imaging unit POPLI-3C
Light source for PL excitation compatible with 6-inch solar cells. By combining it with the EL image inspection device PVX series, PL observation becomes possible.
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Solar Cell EL Image Measurement Device PVX330
Industry standard that vividly reveals potential defects in solar cells, EL image inspection device PVX330.
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EL/PL Imaging Device PVX1000+POPLI-Octa
The wafers in the solar cell manufacturing process can be evaluated using photoluminescence.
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Microscopic EL/PL imaging device PVX1000+POPLI-μ
Microscopic PL observation of the fine structure of wafers in the solar cell manufacturing process.
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Wafer processing service
We create new value in semiconductor wafer services such as film formation processing and regeneration processing!
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Solar panel maintenance and upkeep - Solament SZ-200
The String Checker SZ-200 can identify solar panel failures on a string-by-string basis.
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Solar panel maintenance and upkeep - Solament SI-200
The Solar Panel Checker SI-200 can easily detect faulty panels during operation.
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Solar panel maintenance and upkeep - Solament SR-200
With Solamente SR-200, panel inspection before interconnection is possible.
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