All products and services
91～120 item / All 360 items
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[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)
It is possible to perform 3D measurements of the surface roughness of samples and surface shape measurements through transparent objects!
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Contract Analysis: Laser Microscope (Observation & Measurement)
Observation and measurement over a wide range are also possible! Here is an introduction to contract analysis using a laser microscope.
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Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!
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Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!
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IC failure analysis
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
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OBIRCH analysis of SiC devices using short-wavelength lasers.
Since semiconductors have different physical properties, new methods are required for failure analysis!
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Failure analysis of an orange LED damaged by electrostatic discharge.
We will introduce a comparison of brightness and characteristics between good products and ESD-damaged products, along with examples of luminescence analysis using EMS microscopy!
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Backside light emission analysis of SiC devices
Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!
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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.
Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure analysis!
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Analysis of good LCD panels
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
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Observation of diffusion layers in semiconductors using FIB-SEM.
Shorter delivery time than his method! Both shape observation using FIB-SEM and diffusion layer observation can be performed!
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Evaluation of membrane quality using EELS analysis method
EELS analysis for element identification allows for the comparison of the bonding states of materials!
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Narrowing down defective areas using the EBAC (Absorption Current) method.
"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.
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Whisker evaluation
The inspector observes without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.
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MLCC crack X-ray observation
Cracks that couldn't be detected visually might be found with X-rays!
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Power semiconductor analysis service
We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!
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EBSD analysis of flexible printed circuits (FPC)
We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!
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Defective analysis of liquid crystal panels
We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!
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[Data] Research Institute of Chemical Reaction Mechanisms - Case Study on the Causes of Material Discoloration
Clear publication of analysis results using polyamide imide materials and IR devices, as well as data analysis!
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Analysis of metal corrosion using micro-Raman spectroscopy.
Analysis of inorganic compounds such as metal oxides is also possible!
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Analysis of inorganic compounds using micro-Raman spectroscopy.
Analysis of inorganic compounds such as metal oxides is also possible! We will introduce the analysis of black spots on the surface of copper-clad laminates.
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Example of analysis using EBSD (ceramics)
Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!
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Material evaluation using a ultra-micro hardness tester.
Useful for long-term quality control! Ultra-microhardness measurement of materials such as metals, polymers, and ceramics.
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[Data] Research Institute of Chemical Reaction Mechanisms, Delamination Mechanism of Heterogeneous Material Interfaces 1
We will introduce a case that elucidates the differences in linear expansion coefficients of PET and PEN films with similar main skeletal structures and the mechanisms that produce these differences.
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LED failure analysis
Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.
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Backside polishing of semiconductors for luminescence analysis.
Back grinding is possible with various types of semiconductors! You can observe the elements and the condition of defects.
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Analysis case of low molecular organic acids by ion chromatography.
Detection of certain organic substances is possible! Here is an example of measuring low molecular weight organic acids in an anion exchange mode.
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[Data] Whisker Analysis by EBSD
Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
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8-inch IC and MEMS foundry services launched.
At Omron's Yasu facility, which has a maximum 8-inch MEMS line, we respond to various customer requests from prototype to mass production in the wafer process!
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[Defective Analysis Case] X-ray Observation of AC Adapter
Non-destructive X-ray observation is effective for initial inspection! We will introduce examples of defect analysis.
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