Observation of cross-sectional processing of CCD camera module.
With our advanced technology, we can also create cross-sections of highly challenging samples!
The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.
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Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
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Observation of CMOS image sensor cross-section by mechanical polishing.
At our company, we created a cross-section of the CMOS image sensor component associated with A company's VR goggles through mechanical polishing while keeping the component intact, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the CMOS sensor surface, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation method.
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Cross-sectional observation of substrate-mounted components (1) to (6)
We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.
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Cross-sectional observation of substrate-mounted components.
We will introduce examples of cross-sectional observations of various components mounted on a board called an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrate, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as they will not function correctly otherwise. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.