Processing observation
Processing observation
At Aites, we conduct cross-sectional polishing, processing, observation, and analysis.
1～30 item / All 124 items
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Total support service for cross-sectional grinding, processing, observation, and analysis.
We undertake contract processing and manufacturing of cross-sections of various parts and materials.
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[Case Study] X-ray Fluoroscopy and CT Examination Equipment
Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!
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X-ray fluoroscopy and CT scanner: Device appearance and main specifications
Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.
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Cheetah EVO accessory function: Reflow simulator
[Video available] You can observe the heating process in real-time! Introducing the features of Cheetah EVO.
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X-ray fluoroscopy and CT scanner 'Cheetah EVO'
Inspection equipment effective for initial observation of various components and materials, including implementation substrates and electronic parts.
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X-ray fluoroscopy and CT examination device 'Observation case of IC type coil'
X-ray CT observation allows for the assessment of the winding condition of coil wiring! We will introduce examples of observing IC-type coils, which differ from X-ray transmission observation.
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X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'
[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.
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X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopic observation)
[Video Available] Captured the moment of defect occurrence! Introducing a case of X-ray observation using LED.
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X-ray fluoroscopy and CT examination device: Observation case of chip resistors
CT observation is effective for analysis as it allows for three-dimensional observation! Here, we will introduce examples of observing chip resistors.
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X-ray fluoroscopy and CT examination device: Observation case of a microphone
[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.
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X-ray fluoroscopy and CT examination device: Case study of wisdom tooth observation
[Video available] Introducing the X-ray CT image (orthogonal CT) of a wisdom tooth (third molar).
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X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study
X-ray fluoroscopy observation, oblique CT observation, orthogonal CT observation, etc.! Introduction of BGA solder crack analysis cases.
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X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.
Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmitted observation and image processing technology.
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MLCC crack X-ray observation
Cracks that couldn't be detected visually might be found with X-rays!
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Slice processing using isomet.
We will introduce a slicing process that allows you to keep the created cross-section as it is!
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Cutting process using a wire saw
Cross-section preservation is possible! By dividing the sample with precision cuts using a wire saw, individual cross-sections can be produced.
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Cross-sectional observation pre-treatment (sample cutting and resin embedding)
We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!
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Cross-section polishing (CP) method for cross-sectional observation service.
Achieve high processing precision and a wide processing area! Machining is also possible while reducing damage with cooling functions.
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Cross-sectional polishing service for implementation parts and electronic components.
Each part is carefully polished by hand, using an efficient process without waste!
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Surface mount electronic component cross-sectional observation service
You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!
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The state of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.
Introducing the perspectives from which analysis and analytical techniques should be advanced!
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Analysis of the assembly joints of the implemented components
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
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EBSD analysis of flexible printed circuits (FPC)
We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!
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Crystal analysis by EBSD BGA
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
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[Example of analysis using EBSD] Chip
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
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[Example of Analysis by EBSD] Screw
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
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[Example of analysis using EBSD] Pipe
I will introduce an example of analysis using EBSD for pipes (austenitic).
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Example of analysis using EBSD: Via
The EBSD method allows for the estimation of crystal size distribution and residual stress.
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[Example of analysis using EBSD] High melting point solder
Observing crystal structures with EBSD! Data can be obtained for each metal.
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Example of analysis using EBSD: Steel plate
Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.
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