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Cutting process using a wire saw

Cross-section preservation is possible! By dividing the sample with precision cuts using a wire saw, individual cross-sections can be produced.

We would like to introduce the cutting process using a wire saw at AITES Co., Ltd. With a wire saw, it is possible to create multiple cross-sections from a single sample by cutting and dividing it. Since it does not involve grinding, observations and analyses can be conducted again. Additionally, in cutting examples, even small and brittle white rice can be divided without causing cracks or chips. If you have any requests ranging from cutting processes to observations and analyses, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.

Related Link - https://www.ites.co.jp/section/index/%e5%8a%a0%e5%…

basic information

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Price range

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Applications/Examples of results

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Cutting process using a wire saw

PRODUCT

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

TECHNICAL

Overseas parts and products evaluation service

PRODUCT

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER

Slice processing using Isomet.

PRODUCT

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

PRODUCT

Regarding the curing temperature of epoxy resin during sample encapsulation.

TECHNICAL

Recommended products

Distributors

Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.