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Total support service for cross-sectional grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.ites.co.jp

basic information

For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

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Total support service for cross-section grinding, processing, observation, and analysis.

OTHER

[Data] Whisker Analysis by EBSD

OTHER

[Data] Structural Analysis of MEMS Components

OTHER

Observation of diamond clarity

OTHER

Oblique CT observation of the laminated substrate

PRODUCT

Measurement of solder crack rate by cross-sectional observation.

PRODUCT

Example of EPMA analysis using the guide network map method.

PRODUCT

The microtome's blade (knife) is its lifeline.

OTHER

[Information] Differentiating Between Optical Microscopes and SEM

OTHER

Surface observation of IC chips implemented on LCD panels.

TECHNICAL

Analysis case of faulty switch contacts

TECHNICAL

Optical film light transmission characteristics

OTHER

Observation of CMOS image sensor cross-section by mechanical polishing.

TECHNICAL

Analysis of electronic components and materials using TEM.

PRODUCT

Material evaluation using a ultra-micro hardness tester.

OTHER

Observation of the coating film

PRODUCT

Energy Dispersive X-ray Spectroscopy (EDS)

PRODUCT

[Analysis case by EDS] Bonding interface of Cu pad

TECHNICAL

Cross-sectional observation of substrate-mounted components.

TECHNICAL

Cross-sectional observation of substrate-mounted components (1) to (6)

TECHNICAL

CP processing device Arblade5000_ Wide Area Cross-section Milling

PRODUCT

Example of analysis of compounds at the interface between SAC solder and Ni pads.

TECHNICAL

[Case Study] X-ray Fluoroscopy and CT Examination Equipment

TECHNICAL

Sectioning using a microtome

TECHNICAL

Differences in appearance due to SEM observation conditions.

TECHNICAL

3D construction through mechanical grinding

PRODUCT

Introduction to Section Processing and Observation Methods

OTHER

MLCC crack X-ray observation

TECHNICAL

Cross-section polishing (CP) method for cross-sectional observation service.

PRODUCT

Regarding the curing temperature of epoxy resin during sample encapsulation.

TECHNICAL

Authenticity investigation (comparative observation)

PRODUCT

Examples of semiconductor observation through mechanical polishing.

OTHER

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

PRODUCT

X-ray fluoroscopy and CT examination device: Case study of BGA solder crack analysis

TECHNICAL

[Data] Example of load unloading mode and color filter measurement using an ultra-micro hardness tester.

OTHER

Observation of metallic tissue through chemical treatment.

TECHNICAL

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

TECHNICAL

[Information] Whisker Observation - Tips for Observing Flat Whiskers

OTHER

[Data] EPMA Analysis Example 2

OTHER

Analysis of the assembly joints of the implemented components

PRODUCT

Surface mount electronic component cross-sectional observation service

PRODUCT

[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (Scanning Electron Microscope)

OTHER

Observation of aluminum welding joints

TECHNICAL

Cross-sectional observation of large samples (expansion valve)

TECHNICAL

Changes due to differences in acceleration voltage during EDX analysis.

OTHER

Basic Analysis Methods for Things that are Similar yet Different

OTHER

Ultrasonic Microscope 'SAM'

PRODUCT

[Data] Cross-sectional observation of solar cell modules

OTHER

Seven spectral crystals in EPMA analysis

TECHNICAL

[Data] Example of EPMA Analysis

OTHER

Evaluation of BGA/CSP solder

OTHER

Cross-sectional polishing service for implementation parts and electronic components.

PRODUCT

Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

OTHER

X-ray observation of electrolytic capacitors

OTHER

Cross beam FIB cross-sectional observation

PRODUCT

Crystal analysis by EBSD: Intermetallic compounds in solder joints

PRODUCT

[Dataset] LCD Panel Analysis Dataset

OTHER

Crystal analysis by EBSD BGA

PRODUCT

[Information] Regarding the bonding interface of Cu wire bonding.

TECHNICAL

Cross-sectional observation by SEM: Connector plating

TECHNICAL

FE-SEM observation (Crystal grain observation of Al wire bonding section)

PRODUCT

Appearance observation and measurement services

PRODUCT

Observation of tracking camera cross-section by mechanical polishing.

OTHER

About the curing temperature of epoxy resin free of hazardous substances.

OTHER

Cryogenic ion milling cross-section processing example (rubber products)

PRODUCT

Effects of heat generated during cross-sectional ion milling (CP) processing.

TECHNICAL

Example of failure analysis of chip resistors

TECHNICAL

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