Cross-sectional observation pre-treatment (sample cutting and resin embedding)
We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!
We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.
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About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
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Micro FT-IR imaging measurement
We would like to introduce the "Microscopic FT-IR Imaging Measurement" that we conduct. It allows for the visualization of the distribution of substances as a two-dimensional image within a specified plane. It becomes possible to evaluate changes in the distribution of substances that are difficult to assess with regular point measurements through visual images.
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Solder Heat Resistance Test (SMD)
Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process. We replicate moisture absorption before mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting. Additionally, as part of the post-test inspection, we perform inspections identical to the initial measurements and, if necessary, conduct analyses such as cross-sectional observations of defective parts. For more detailed information, please refer to the related products and catalogs.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.