アイテス Official site

Slice processing using isomet.

We will introduce a slicing process that allows you to keep the created cross-section as it is!

Aites Co., Ltd. performs slicing processing using isomet. When you want to observe the cross-section of all connector pins in multiple rows, the usual procedure is to grind down to the next row... However, by performing slicing processing, it is possible to keep the created cross-section as it is. Additionally, we have examples of slicing processing for connector pins with multiple rows. *For more details, please refer to the PDF materials or feel free to contact us.*

Related Link - https://www.ites.co.jp/https://www.ites.co.jp/sect…

basic information

For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

Slice processing using Isomet.

PRODUCT

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

TECHNICAL

Overseas parts and products evaluation service

PRODUCT

Total support service for cross-section grinding, processing, observation, and analysis.

OTHER

Cutting process using a wire saw

PRODUCT

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

PRODUCT

Regarding the curing temperature of epoxy resin during sample encapsulation.

TECHNICAL

Recommended products

Distributors

Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.