Processing observation
Processing observation
At Aites, we conduct cross-sectional polishing, processing, observation, and analysis.
91～120 item / All 123 items
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Example of EPMA analysis using the guide network map method.
Comprehensive analysis is possible! Here are examples of analysis using the EPMA guide network map method.
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Observation of Pb-free solder cross-section after reliability testing.
Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.
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The microtome's blade (knife) is its lifeline.
Using glass knives and diamond knives for sample cutting! Introducing with examples of cross-sectional observation.
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[Case of EBSD] Comparison of two brass materials
Visualizing the differences between two samples based on differences in crystal structure! Introducing a case study of EBSD analysis.
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[Information] Differentiating Between Optical Microscopes and SEM
Comparing optical microscopes and SEM with the same sample! I will explain the advantages and disadvantages.
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Energy Dispersive X-ray Spectroscopy (EDS)
Detecting characteristic X-rays! An effective analytical method for obtaining elemental information in micro-regions and small foreign substances.
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[Analysis Example by EDS] Bonding Interface of Cu Pad
It is possible to view the distribution of each element in two dimensions! This can also be effective when analyzing multilayer samples.
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3D construction by mechanical polishing
Introducing the advantages and disadvantages of 3D construction using X-ray CT and FIB slice cross-sections, as well as the 3D construction method using mechanical polishing!
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Introduction to Cross-Section Processing and Observation Methods
Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.
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Announcement of the Introduction of FIB-SEM Helios 5 UC
Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!
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One-shot 3D shape measuring device "VR-6200"
With this one device, you can measure various things! It can reproduce cross-sectional shapes without cutting, and it can also measure glossy surfaces!
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Roundness / Circularity Measurement
We will respond to your request to evaluate roundness and circularity!
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Cross-sectional hardness of aluminum welds (spot welding)
Cross-sectional observation and hardness measurement of the weld joint were conducted! It was found that the void in the center is a blowhole.
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Surface observation of IC chips implemented on LCD panels.
The observation target is an IC chip connected to the LCD panel using the COG mounting method! The circuit surface was clearly visible.
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Examples of observing intermetallic compounds through etching treatment.
Observe the state of the compound from the direction of the back and the surface! We will consider and propose processing, pretreatment, observation methods, and combinations.
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Analysis case of faulty switch contacts
Appearance inspection, electrical inspection, and internal observation using X-rays conducted! Introduction of analysis cases.
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Observation of Conductive Particle Shapes in COG Implementation
Observing the conductive particles from the planar direction and the cross-sectional direction! A case study confirming the degree of deformation.
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Cross-sectional observation of substrate-mounted components.
Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.
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Cross-sectional observation of substrate-mounted components (1) to (6)
Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!
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Examples of semiconductor observation through mechanical polishing.
Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.
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Observation of metallic tissue through chemical treatment.
You can gain clues about the quality of the product and investigate defects from the shape of the organization!
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CP processing device Arblade5000_wide area cross-section milling
It is possible to process with approximately twice the width! This significantly expands the previously localized observation range.
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Example of analysis of compounds at the SAC solder and Ni pad interface.
It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.
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Evaluation of various implementation substrates
IPC-A-610 certified IPC specialists are available! Assistance with observations in accordance with international standards.
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Observation of CMOS image sensor cross-section by mechanical polishing.
Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!
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Appearance observation and measurement services
We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!
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Observation of tracking camera cross-section by mechanical polishing.
Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!
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Observation of substrate deformation using a 3D shape measuring machine (VR-6200)
Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.
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About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature at which heat is generated during hardening!
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Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case study on the method of processing cross-sections using toy car tires!
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