Processing observation
Processing observation
At Aites, we conduct cross-sectional polishing, processing, observation, and analysis.
31～60 item / All 123 items
-
Crystal analysis by EBSD: Intermetallic compounds in solder joints
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
last updated
-
EBSD analysis
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
last updated
-
Crystal analysis of Cu using the EBSD method.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
last updated
-
Example of analysis using the EBSD method
We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.
last updated
-
[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)
It is possible to perform 3D measurements of the surface roughness of samples and surface shape measurements through transparent objects!
last updated
-
Contract Analysis: Laser Microscope (Observation & Measurement)
Observation and measurement over a wide range are also possible! Here is an introduction to contract analysis using a laser microscope.
last updated
-
Regarding the bonding interface of Cu wire bonding.
We introduce the features of Cu wire bonding and the selection of cross-section preparation methods!
last updated
-
[Information] About the bonding interface of Cu wire bonding
It provides a detailed explanation of various wire bonding methods, results, and discussions!
last updated
-
Whisker evaluation
The inspector observes without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.
last updated
-
Example of analysis using EBSD (ceramics)
Examples of analysis using EBSD, such as 'Observation/Elemental Analysis' and 'Analysis by EBSD'!
last updated
-
Material evaluation using a ultra-micro hardness tester.
Useful for long-term quality control! Ultra-microhardness measurement of materials such as metals, polymers, and ceramics.
last updated
-
[Data] Whisker Analysis by EBSD
Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
last updated
-
8-inch IC and MEMS foundry services launched.
At Omron's Yasu facility, which has a maximum 8-inch MEMS line, we respond to various customer requests from prototype to mass production in the wafer process!
last updated
-
Observation of cross-sectional processing of CCD camera module.
With our advanced technology, we can also create cross-sections of highly challenging samples!
last updated
-
[Data] Processing damage caused by mechanical grinding method
If you have any dissatisfaction or questions regarding the finish of the grinding, please consult Aitesu!
last updated
-
[Data] Cross-sectional observation of solar cell modules
We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!
last updated
-
Crack observation using a tabletop SEM (scanning electron microscope).
Fine cracks are easy to see! No conductive treatment is required, allowing for quick and detailed observation.
last updated
-
[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope)
We have published cross-sectional observations in clear vision mode and normal/standard mode!
last updated
-
[Information] Cross-section production method
We are publishing the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!
last updated
-
[Observation Case] X-ray Observation of a Toggle Switch
Observation of the misalignment of the internal metal plate! This is a case study of a toggle switch observed using X-ray fluoroscopy and orthogonal CT observation.
last updated
-
Sample preparation techniques for foreign object analysis
We utilize various sample processing techniques to provide rapid analysis results! Let us introduce our sample processing technology.
last updated
-
Sectioning using a microtome
Suitable for producing cross-sections of soft materials such as liquid crystal polarizers and aluminum cans!
last updated
-
Appearance observation using a digital microscope.
Accurately grasping defects! It is possible to conduct extensive bulk observations as well as partial magnifications, accommodating various types of observations.
last updated
-
EPMA analysis
Supports 100×100mm size! The movable stage allows for extensive mapping.
last updated
-
[Analysis Example by EBSD] Kanikan
Here is an example of analysis regarding the broken part of a crab claw that was damaged due to long-term use!
last updated
-
[Defective Analysis Case] X-ray Observation of AC Adapter
Non-destructive X-ray observation is effective for initial inspection! We will introduce examples of defect analysis.
last updated
-
Structural analysis of prismatic Li-ion batteries.
Observation using optical microscopy and ultra-low acceleration FE-SEM! Detailed structural analysis and elemental analysis are possible.
last updated
-
[Data] Whisker Observation
Support from reliability testing observations to 3D measurement! It is possible to conduct whisker evaluations while eliminating transportation risks.
last updated
-
Analysis of Li-ion battery separators
I confirmed the blocking function of polymer melting at high temperatures!
last updated
-
【Equipment】FIB (Focused Ion Beam)
Semiconductors, MEMS, liquid crystal glass, etc.! Capable of cross-section processing in micro areas and producing TEM samples.
last updated