Sample preparation techniques for foreign object analysis
We utilize various sample processing techniques to provide rapid analysis results! Let us introduce our sample processing technology.
Foreign substances that significantly affect the yield of electronics products must be analyzed promptly. Our company utilizes various sample processing techniques to provide rapid analysis results. The materials introduce the excavation of foreign substances buried in multilayer films and an overview of micro cutting tools. 【Micro Cutting Tool Specifications】 ■ Cutting edge width: 50μm or 100μm ■ Cutting depth: Approximately 2 to 300μm ■ Cutting targets: Resins, glass, Si wafers, metals, etc. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
"Excavation of foreign objects buried in multilayer films" ■ Foreign objects in multilayer thin films ■ Cutting of the surface layer ■ Sampling FT-IR analysis transferred onto a Si wafer ■ Moving a cutting blade that vibrates ultrasonically for cutting *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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