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EBSD analysis

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.ites.co.jp/analyze.html

basic information

【Map Examples】 ■ IQ Map (Image Quality Map) ■ IPF Map (Inverse Pole Figure Map) ■ Crystal Direction Map ■ GROD Map ■ Pole Figure ■ Inverse Pole Figure *For more details, please refer to the PDF document or feel free to contact us.

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For more details, please refer to the PDF document or feel free to contact us.

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Total support service for cross-section grinding, processing, observation, and analysis.

OTHER

Regarding the bonding interface of Cu wire bonding.

TECHNICAL

[Information] Regarding the bonding interface of Cu wire bonding.

TECHNICAL

Crystal analysis of Cu using the EBSD method.

PRODUCT

Example of analysis using the EBSD method

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[Example of analysis using EBSD] Screw

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Crystal analysis by EBSD BGA

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Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

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[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

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[Analysis Example by EBSD] Chip

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[Data] Whisker Analysis by EBSD

OTHER

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

TECHNICAL

[Example of analysis using EBSD] Silicon wafer

TECHNICAL

[Case of EBSD] Comparison of two brass materials

TECHNICAL

Example of analysis of compounds at the interface between SAC solder and Ni pads.

TECHNICAL

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.