[Data] Processing damage caused by mechanical grinding method
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This document introduces processing damage caused by mechanical polishing methods. Mechanical polishing is a long-established technique for cross-section preparation, capable of producing cross-sections over a wide range, from a few centimeters to about 10 centimeters. However, damage such as altered layers, steps, elongation (stretching), and embedding can occur during processing, leading to issues like "something that should be there is missing" and "something that shouldn't be there is present." At Aites, we perform highly reliable cross-section preparation based on the technology and experience we have cultivated over many years. [Contents] ■ Main processing damages in mechanical polishing methods ■ Importance of polishing finishes tailored to material characteristics ■ Case studies involving solder (BGA) *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.